Expand Memory in a Lenovo ThinkSystem SR950 V3
Memory-expansion access and reassembly for Lenovo ThinkSystem SR950 V3, checked against the same-model official English service instructions. The primary chassis is the lower enclosure and the secondary chassis is the upper enclosure in the illustrated configuration. Most original diagrams use English labels or numbered callouts; the front-control detail below is from Lenovo’s English documentation.
Choose the access path for the actual slots: an upper-board-only DIMM change needs the upper air baffle removed, without removing the CPU board. Lower-board DIMMs require the additional CPU-board/lower-air-baffle access shown here. Lenovo explicitly forbids changing DIMMs or PHMs on an upper CPU board removed from the chassis. If working on both boards, change the lower-board DIMMs while exposed, reinstall and secure the upper board, then change its DIMMs before refitting the upper baffle.
Use an approved configuration for the actual processors, DIMMs and memory mode. The source refers to a population table but does not supply the job-specific plan. Use Lenovo’s SR950 V3 memory layouts/order and the applicable Independent or Mirroring table rather than inferring a population sequence from the access drawings. Use the platform’s ESD and lifting procedures before handling the system.
Verify the device
There is a pull-out information card at the bottom of the device; verify that the device serial number is correct.

Remove the security bezel.
Unlock the security bezel.


Confirm that the system is shut down. A slowly blinking green power LED (about once per second) indicates standby, not electrical isolation. Identify the intended system with its ID control before disconnecting power.

Official English control-detail figure replacing the source’s annotated full-front view: 1 Power button/green LED; 2 Network activity; 3 System ID button/blue LED; 4 System error. It identifies the controls, not the actual current LED states.
Remove rear cables.
Label all data cables behind the device, then remove all data cables behind the device.
Disconnect power from every PSU: primary/lower chassis first, then secondary/upper chassis. The source’s IN-only example is a standby observation, not permission to work with input power connected. After disconnecting all power cords, wait at least 20 seconds before handling DIMMs, as required by the current SR950 V3 memory-installation instructions.

The IN / OUT / ! graphic identifies PSU indicators only; it is not a measured live state or proof that all power has been disconnected.
Power-supply indicator labels (schematic)

Remove front cables.
Disconnect the two external sideband cables, recording their original connections.

Open the UPI cover on the primary chassis.

Disconnect the eight external UPI cables from the primary chassis using their labels; repeat the required disconnection at the secondary chassis before removing the cable set.

Verify that all external connection cables in the front have been removed, and organize all cables properly.
Before moving the chassis, follow the official rail-guide lifting choice. Lenovo’s two-person method requires prior removal of all PSUs, storage drives and the top cover; otherwise it calls for three people or a lifting device. Keep any removed drives identified for their original locations. Do not infer that installing handles alone makes an arbitrary two-person lift appropriate.
Remove the primary chassis.
Using the approved lifting method, slide the chassis out to the first stop and attach both front lift handles to their six-post mounts before sliding farther.

Lift the first pair of lock latches to continue sliding out.

Attach both rear lift handles before releasing the next stop and sliding farther.

Lift the second sliding lock,completely remove the server from the rack; then place it on a flat surface.


Remove the top front cover.
Use a screwdriver to unlock the cover.

Remove the top front cover from the chassis.

Remove the upper processor board (CPU BD) air baffle.
Disconnect cables from the M.2 boot adapter.
- Loosen the screws on the signal cables.
- Tilt the interface and remove it.
- Disconnect the power cable.

1. First record the cable connection method; then, disconnect and lift the cables passing through the upper processor board (CPU BD) air baffle, and set them aside.
2. Grasp the two blue handles on the upper processor board (CPU BD) air baffle, and carefully remove the shroud from the chassis.

Remove the CPU board.
Disconnect the UPI module cables from the upper processor board (CPU BD).

- Open the cable clamp and loosen the UPI module cables.
- Disconnect the UPI module cables from the upper processor board (CPU BD).
Disconnect internal sideband cables from the upper processor board (CPU BD) and the lower processor board (MB).

Disconnect internal UPI cables.

- Remove the internal UPI cable from the upper processor board (CPU BD).
- Remove the internal UPI cable from the cable clip.
Disconnect the upper-board power cables as well as its UPI/sideband connections before lifting the board. Record each connector and route so the original arrangement can be restored.
List all remaining cables and record the interfaces to which they are connected; then, remove all remaining cables from the upper processor board (CPU BD) to ensure no cables are connected.
Release the upper processor board (CPU BD).

- Loosen three thumbscrews. If necessary, use a screwdriver.
- Open the plunger to the unlocked position.
Grasp the blue handle and remove the upper processor board (CPU BD).

Set the removed CPU board on an appropriate static-protective surface, using its designated handles. Do not remove or install DIMMs or processor/heat-sink modules while this board is outside the chassis.
Remove the lower processor board (MB) air baffle.
First, record the cable connection method; then, unplug the cables passing through the lower processor board (MB) air baffle and set them aside.
Grasp the two blue handles on the lower processor board (MB) air baffle and carefully remove it from the chassis.

Install the planned lower-board DIMMs; use the upper-board map only as a reference here
Lower processor board (MB) DIMM/processor layout

Upper processor board (CPU BD) DIMM/processor layout

For this lower-board access path, install the approved DIMMs on the lower processor board now. Verify module identity and slot position against the plan, align the keyed connector, press both ends evenly and confirm that both clips lock with no gap. The upper-board drawing is a location reference; any upper-board DIMM change must wait until that board is installed back in the chassis, or be done before removing it.

Install the lower processor board (MB) air baffle
Grasp the two blue handles, align the tabs of the lower processor board (MB) air baffle with the slots on both sides of the chassis; then, insert the lower processor board (MB) air baffle into the chassis.

- Gently press down on the lower processor board (MB) air baffle until it is securely seated.
- Reconnect all previously unplugged cables and route them through the lower processor board (MB) air baffle.
Install the upper processor board (CPU BD)
Grasp the blue handle, insert the upper processor board (CPU BD) downward into the chassis until the T-shaped pins inside the chassis engage with the upper processor board (CPU BD).

Secure the upper processor board (CPU BD)

- Close the plunger to the locked position.
- Tighten three thumbscrews. If necessary, use a screwdriver.
Connect the power supply cables to the upper processor board (CPU BD).

Connect the internal UPI cable

- Route the internal UPI cable through the cable clip.
- Connect the internal UPI cable to the upper processor board (CPU BD).
Connect the internal sideband cable to the upper processor board (CPU BD) and the lower processor board (MB).

Connect the UPI module cable

- Connect the UPI module cable to the upper processor board (CPU BD).
- Route the UPI module cable through the cable clip, then close the cable clip.
Reconnect the recorded cables. With the upper processor board fully seated and secured inside the chassis, install any planned upper-board DIMMs now if required, using the same approved population plan and seating/clip checks. Do not perform that operation on the removed board. Complete the check before fitting its air baffle.
Install the upper processor board (CPU BD) air baffle
Grasp the two blue handles, align the tabs of the upper processor board (CPU BD) air baffle with the slots on both sides of the chassis; then, insert the upper processor board (CPU BD) air baffle into the chassis.

- Gently press down on the upper processor board (CPU BD) air baffle until it is securely seated.
- Reconnect all previously unplugged cables and route them through the upper processor board (CPU BD) air baffle.
- Connect the cables to the M.2 boot adapter.

- Tilt the M.2 signal connector at 20 degrees or less, and insert it until its bottom surface reaches the ramp. The source prose’s “at least 20 degrees” is corrected to match Lenovo’s English procedure and the figure’s 20° max callout.
- Press the M.2 signal connector down flat.
- Tighten the screws on the signal cables.
- Connect the power cable (4) to the M.2 boot adapter.
Install the front top cover
- Align the guide pins of the front top cover with the guide holes on the chassis; then place the front top cover on top of the chassis and align both sides.
- Rotate the sliding lock downward until it cannot rotate further.

Insert the server into the rails
Install the handle

Install the server onto the rack.
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| Note When moving the server, always grasp the lift points or lift handles of the server. |
| Note Before inserting the inner rail into the middle rail, ensure that the ball retainer is at the very front of the middle rail. | |
Align the two rear ends of the inner rail with the openings on the middle rail, and ensure that the two pairs of rails are properly engaged. Then, carefully slide the server into the rack until the rails click into place.

Remove the rear lift handles
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Note: Ensure that both rear lift handles are removed before continuing to slide in. |
Lift the first pair of lock latches to continue sliding the server into the rack until the rails click into place.

Remove the front lift handles
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Note: Ensure that both front lift handles are removed before continuing to slide the server in. Warning: Do not lift the second pair of lock latches until all handles have been properly removed. |
Lift the second pair of lock latches to continue sliding the server in.

Repeat the above steps for the secondary chassis (upper chassis).
Connect the front cables after both chassis are installed.
Connect the external eight UPI cables to the primary chassis. Ensure that the cables match the numbers and patterns shown on the UPI labels.

Close the UPI covers on the primary chassis and the secondary chassis.

- Close the UPI cover.
- Tighten the thumbscrews to secure the UPI cover. Use a screwdriver if necessary.
Connect the sideband cables to the primary chassis and the secondary chassis.

Reconnect the recorded external data/sideband/UPI connections and reinstall all required components before restoring power. Connect power cords to the secondary/upper chassis first, then the primary/lower chassis, following the SR950 V3 power-on instructions.
Reinstall all components previously removed.
Secure the server to the rack
Rear
| Front
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1. Hook Latch | |
Note: When performing the following instructions, use a flathead, hex socket, or Phillips screwdriver.
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If the security bezel has been removed, reinstall it.

Complete and verify the maintenance
Before powering on, confirm both boards, cable latches/screws, air baffles and covers are correctly reassembled and no tools or loose parts remain. Follow the approved startup plan, check the detected memory against the intended configuration and inspect firmware/management events. A seating illustration is not proof of successful memory detection. No hardware, memory, firmware or power state was changed while preparing this document.
Official English references
- Front operator-panel controls and standby indication
- Power-off and primary-then-secondary disconnection
- Secondary-then-primary power connection
- Rail removal and approved lifting method
- Rail installation, handles and external cables
- CPU-board removal and prohibition on DIMM/PHM work outside the chassis
- Memory installation, clip checks and discharge interval
- Upper air baffle and M.2 connector angle
- Memory layout and population guidance






